发明名称 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition capable of forming a resist pattern having reduced roughness and superior profile, and to provide a resist pattern forming method. <P>SOLUTION: The positive resist composition contains a resin component (A), of which the alkali solubility increases under the action of an acid and an acid generator component (B) which generates acid upon exposure to light, wherein the resin component (A) comprises a constitutional unit (a0), represented by general Formula (a0) [wherein R denotes H, halogen, a lower alkyl group or a halogenated lower alkyl group; Y<SP>1</SP>denotes an alicyclic group; Z denotes an acid-dissociable dissolution inhibiting group; a denotes an integer of 1-3, b denotes an integer of 0-2, a+b=1 to 3; and c, d and e, each independently denote an integer of 0-3] and a constitutional unit (a1) derived from an acrylic ester containing an acetal type acid-dissociable dissolution inhibiting group and does not correspond to the constitutional unit (a0). <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007240718(A) 申请公布日期 2007.09.20
申请号 JP20060060930 申请日期 2006.03.07
申请人 TOKYO OHKA KOGYO CO LTD 发明人 KINOSHITA YOHEI;FURUYA SANAE;IWAI TAKESHI;HANEDA HIDEO
分类号 G03F7/039;C08F220/10;G03F7/004;H01L21/027 主分类号 G03F7/039
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