| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable more accurate measurement of the voltage on a die in a semiconductor package. <P>SOLUTION: For example, a semiconductor device 300 is provided with a plurality of voltage sensors 302, which detect the voltages of different positions on the die, respectively. Furthermore, the semiconductor device 300 is provided with a plurality of Vdd detection pins 312 for supplying the voltage signal detected by the voltage sensors 302 to a VPU320. The VPU320 generates a typical voltage signal from the voltage signal detected by the voltage sensor 302 and gives the typical voltage signal to a comparator 130. The comparator 130 compares the typical voltage signal generated from the VPU320 and a voltage reference signal 140 and provides a difference signal to a VRM150. The VRM150 adjusts the power given to the semiconductor device 300, based on the difference signal provided from the comparator 130. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
