摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam fusion-cutting method capable of effectively preventing degradation of the strength of a product caused by generation of microcracks. <P>SOLUTION: When performing fusion cutting of a silicon wafer, a thin plate glass or the like by using a laser beam fusion-cutting method, the laser beam irradiation starting positions P<SB>S</SB>and P<SB>E</SB>when the fusion cutting is started and ended are set outwardly apart from an outer periphery of a product area where a product 51A is formed after the fusion cutting. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |