发明名称 METHOD FOR MANAGING THICKNESS OF HEAD UNIT AND METHOD FOR MANUFACTURING HEAD UNIT
摘要 PROBLEM TO BE SOLVED: To realize a method for managing the thickness of a head unit capable of early discovering shortage of an adhesive among plate members constituting the head unit, and to realize a method for manufacturing the head unit. SOLUTION: When the whole plate thickness obtained by summing up respective plate thicknesses of a cavity plate 31 to a nozzle plate 38 is B, a set value of a thickness of an adhesive layer existing between the plate members per set is C, and the number of the laminated plate members is 8, as the total thickness of the adhesive layers C1-C7 summing up the adhesive layers L1-L7 among respective plate members becomes 7×C, the whole plate thickness of the cavity unit 50 can be expressed by B+(N-1)×C. Namely, when a managing value of the whole plate thickness of the cavity unit 50 is A, if the whole plate thickness is managed so as to satisfy A≥B+(N-1)×C, it is possible that such the adhesive layer that has a thickness smaller than the set value C does not exist. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008023768(A) 申请公布日期 2008.02.07
申请号 JP20060196816 申请日期 2006.07.19
申请人 BROTHER IND LTD 发明人 ITO ATSUSHI
分类号 B41J2/16;B41J2/045;B41J2/055 主分类号 B41J2/16
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