| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating device capable of effectively removing surface roughness occurring on a periphery of the substrate and the like and films attached to the periphery of the substrate and the like that can be contamination sources, in a semiconductor device manufacturing process and the like. SOLUTION: The substrate treating device is provided with a polishing tape 21, a mechanism that rotates the substrate W, and a polishing head 41 that presses the tape 21 against a bevel section of the rotating substrate. The head 41 is provided with a support section 42 having two protrusions 42a, 42b, an elastic member 43 that supports the tape 21 extended between the ends of the protrusions 42a, 42b, and an air cylinder 45 that moves the head 41 in the radial direction of the substrate. The supporting section 42 of the head 41 is moved in the radial direction of the substrate by the cylinder 45 to extend the elastic member 43 to generate a tension in it, and this tension allows the tape 21 to be pressed against the bevel section of the substrate by a certain force to polish the bevel section. COPYRIGHT: (C)2008,JPO&INPIT |
