INTEGRATED CIRCUIT PACKAGE

摘要

PURPOSE: An integrated circuit package is provided to obtain an improved bonding system which bonds a metal heat spreader to a semiconductor chip by using a first bonding material and a second bonding material. CONSTITUTION: An integrated circuit package comprises a semiconductor chip having a chip connection surface, a metal heat spreader having a heat spreader connection surface, and a bond which bonds the chip to the heat spreader. The bond comprises a first bonding material and a second bonding material. The first bonding material is attached to a first portion of the connection surface of the heat spreader. The second bonding material is attached to a second portion of the heat spreader connection surface. Accordign to the integrated circuit package, an improved bonding system which bonds a metal heat spreader to a semiconductor chip is obtained by using a first bonding material and a second bonding material.