| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component module realizing low-profile structure and high-density arrangement, ensuring versatility and extensibility. <P>SOLUTION: The electronic component module 100a is constituted by mounting a passive component 10a on an IC-built-in substrate 50. The passive component 10a has an inductor 12a with a mounting face 14, an opposite face 15 and side faces 16a and terminal electrodes 18a on the side faces 16a. Since the sectional shape of the side faces 16a of the inductor 12a is inclined so as to spread from the mounting face 14 side toward the opposite face 15 side, solder fillet forming margins between the substrate and the side faces 16a can be provided, thereby reducing a distance between it and an adjacent component when mounted and attaining low-profile. Mounting of the passive component 10a on the IC-built-in substrate 50 allows low-profile and increase in versatility of its mounting. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
