| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition whose glass transition temperature is enhanced and elastic modulus can be kept at a lower level. <P>SOLUTION: The epoxy resin composition includes an epoxy resin, a phenolic resin curing agent and a curing promoter, and further includes a curing agent component represented by formula (1). In the formula (1), R<SB>1</SB>, R<SB>2</SB>, R<SB>5</SB>and R<SB>6</SB>each independently denotes a hydrogen atom, a halogen atom, or a 1-6C organic group. R<SB>1</SB>or R<SB>2</SB>and R<SB>5</SB>or R<SB>6</SB>may bond and form a ring and in that case the one or two may be a single bond. R<SB>3</SB>and R<SB>4</SB>each independently denotes a hydrogen atom, a halogen atom or a 1-6C organic group. Ar<SB>1</SB>and Ar<SB>2</SB>each denotes an arylene group. <P>COPYRIGHT: (C)2009,JPO&INPIT |
