发明名称 A METHOD FOR PLATING COPPER ALLOY WITH TIN
摘要 The present invention relates to a method for tin plating a copper alloy. According to the present invention, when the method for tin plating a copper alloy is used, an amount of a black powder generated on a surface of a tin plate is able to be reduced, and generation of spots on the surface is able to be prevented while enhancing gloss. The method for tin plating a copper alloy in accordance with the present invention exhibits outstanding effects in the aspects of preventing the generation of the black powder, enhancing glossiness, reducing the generation of spots, and enhancing an efficiency of production. The method for tin plating a copper alloys comprises: a step of electrolytic degassing a copper alloy; a step of dipping the resultant product in acid; a step of tin undercoating the resultant product; a step of pre-immersing the resultant product; a step of tin plating the resultant product; a step of fluxing the resultant product with an antioxidant at 5-30°C for 5-10 seconds; a step of reflowing the resultant product at 500-600°C for 1-3 minutes; and a step of drying the resultant product at 100-300°C for 1-5 minutes.
申请公布号 KR20160070469(A) 申请公布日期 2016.06.20
申请号 KR20140177459 申请日期 2014.12.10
申请人 PNT CO., LTD. 发明人 LEE, BUEM JAE;LEE, JIN HO;YANG, KAP SOO
分类号 C25D3/30;C25D5/34;C25F1/00;C25F1/02 主分类号 C25D3/30
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