SEMICONDUCTOR, ITS MANUFACTURE AND COMPOSITION FOR SEALING THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in recycle characteristic. SOLUTION: Thermoplastic resin is used as the resin constituting the package 20 sealing a semiconductor element 14. This thermoplastic resin has polyphenylene sulfide(PPS) for its main component, and its linear expansion coefficient at 150-200 deg.C is 2.5-4.5×10-5 [1/ deg.C], and the coefficient ratio of the linear expansion coefficient is 0.55 or over. An adhesion giving agent to raise the adhesion is at a composition ratio of 0.28 to PPS.