LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE ASSEMBLY, LIGHT EMITTING DEVICE PACKAGE MODULE, BACKLIGHT UNIT AND LIGHTING DEVICE

摘要

The present invention relates to a light emitting device package capable of being used for display or lighting purpose, a light emitting device package assembly, a light emitting device package module, a backlight unit and a lighting device. The light emitting device package comprises: a flip chip shaped light emitting device having a first and a second electrode pad on a lower surface; an upper surface optical conversion body formed on the upper surface of the light emitting device at a thickness having a first optical path length and formed by mixing an optical conversion material in media to a first density; and a side surface optical conversion body formed in a shape surrounding the side surface of the light emitting device on the side surface of the light emitting device at a width having a second optical path length and formed by mixing the optical conversion material in the media to a second density. When cutting the side surface optical conversion body by using a chip scale package (CSP) process, to reduce an effect with respect to a cutting error by extending the second optical path length of the side surface optical conversion body, the width of the side surface optical conversion body is larger than the thickness of the upper surface optical conversion body and the second density of the optical conversion material of the side surface optical conversion body is lower than the first density of the optical conversion material of the upper surface optical conversion body.