发明名称 |
TINNED COPPER ALLOY TERMINAL MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To reduce insertion force at fitting even to a terminal using a general purpose tinned terminal material.SOLUTION: There is provided a tinned copper alloy terminal material, where a tin-based surface layer is formed on a surface of a substrate consisting of a copper alloy and a copper tin alloy layer is formed between the tin-based surface layer and the substrate, having oil reservoir depth Rvk of the copper tin ally layer measured when the copper tin alloy layer appears on the surface by melting and removing the tin-based surface layer of 0.2 μm or more, average thickness of the tin-based surface layer of 0.2 μm to 0.6 μm, a silver-based coating layer with film thickness of 0.005 μm to 0.05 μm formed on an outermost surface of the tin-based surface layer and dynamic friction coefficient of the surface of 0.3 or less.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016141835(A) |
申请公布日期 |
2016.08.08 |
申请号 |
JP20150017983 |
申请日期 |
2015.01.30 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
INOUE YUKI;KATO NAOKI;NAKAYA KIYOTAKA |
分类号 |
C25D7/00;C25D5/50;H01R13/03 |
主分类号 |
C25D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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