发明名称 TINNED COPPER ALLOY TERMINAL MATERIAL
摘要 PROBLEM TO BE SOLVED: To reduce insertion force at fitting even to a terminal using a general purpose tinned terminal material.SOLUTION: There is provided a tinned copper alloy terminal material, where a tin-based surface layer is formed on a surface of a substrate consisting of a copper alloy and a copper tin alloy layer is formed between the tin-based surface layer and the substrate, having oil reservoir depth Rvk of the copper tin ally layer measured when the copper tin alloy layer appears on the surface by melting and removing the tin-based surface layer of 0.2 μm or more, average thickness of the tin-based surface layer of 0.2 μm to 0.6 μm, a silver-based coating layer with film thickness of 0.005 μm to 0.05 μm formed on an outermost surface of the tin-based surface layer and dynamic friction coefficient of the surface of 0.3 or less.SELECTED DRAWING: Figure 1
申请公布号 JP2016141835(A) 申请公布日期 2016.08.08
申请号 JP20150017983 申请日期 2015.01.30
申请人 MITSUBISHI MATERIALS CORP 发明人 INOUE YUKI;KATO NAOKI;NAKAYA KIYOTAKA
分类号 C25D7/00;C25D5/50;H01R13/03 主分类号 C25D7/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利