| 摘要 |
<p>PURPOSE: A semiconductor package is provided to realize a compact package by designing to make leads for external terminal inside a molding part, also to reduce the mounting area in PCB and to easily deposit package by connecting the top and bottom surfaces of the lead exposed with a bump. CONSTITUTION: On both sides of the semiconductor chip(11), a number of chip pads are formed. Under the chip pads, bumps(12) are formed respectively. Under the bumps(12), a number of leads(13) are arranged in series so that the top surface of the lower part of the 'Z'-shaped leads(13) contacts with the bump. Epoxy molding part(14) is formed to expose the lead's top and bottom surfaces of the upper and lower parts and also to surround the chip(11), bump(12) and a certain part of the lead(13). Therefore, the semiconductor package(15) is completed.</p> |
