| 摘要 |
PROBLEM TO BE SOLVED: To satisfactorily protect an IC chip contained in an IC card by forming a resin package to enclose the chip by mounting the chip on a board, and providing a fragile part on the board and/or the package. SOLUTION: The module 1 comprises a circular board 2, an IC chip 3 mounted on the board 2, an antenna coil 20 formed on a surface of the board 2, and a resin package 4 for enclosing the board 2 and the chip 3. The chip 3 mounts an electrode 30 to make a continuity with a land 21 formed on the board 2. The chip is mounted in a structure in which an anisotropically conductive film 6 is formed to disperse conductive particles 50 in a resin film 61. The board 2 and the chip 3 are enclosed in the resin package 4. A through hole 40 is formed at the package 4 as a fragile part. Thus, a stress concentration at the chip 3 is avoided to maintain characteristics satisfactory. |
