发明名称 |
Chip lead frames |
摘要 |
Chip lead frames are made by disposing a die having terminals on a substrate surface to form a cavity between the die and the substrate and contacts between the terminals and the substrate. A compound is applied to the surface such that the compound enters that cavity and forms a layer on the upper substrate surface. The layer can impart sufficient rigidity to the assembly that the substrate can be etched to produce a lead frame. Also disclosed are devices that include a die, a lead frame, and a continuous network that can form a layer on the lead frame and fill the cavity between the die and the lead frame.
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申请公布号 |
US2002110956(A1) |
申请公布日期 |
2002.08.15 |
申请号 |
US20010878123 |
申请日期 |
2001.06.08 |
申请人 |
KUMAMOTO TAKASHI;ICHIKAWA KINYA |
发明人 |
KUMAMOTO TAKASHI;ICHIKAWA KINYA |
分类号 |
H01L23/12;H01L21/48;H01L21/56;H01L21/68;H01L23/31;H01L23/50;(IPC1-7):H01L23/495;H01L23/34;H01L29/40;H01L21/44;H01L21/50 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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