| 摘要 |
Process comprises passing a current (pref. current density is not 10 amps/aq. decimeter) from an anode to metal cathode in an aqs. acidic Ni-plating soln. contg. at least one Ni cpd. (which gives suitable Ni ions for electrodeposition) and a semibright additive comprising (1) an aromatic aldehyde (pref. cinnamaldehyde) and (2) an aliphatic aldehyde (pref. formaldehyde). Pref. concn. of (1) and (2) are each 0.01-0.2 g)l and their solutions are both 0.010 g/l in electroplating soln. Plating has uniformly fine-grained structure and has excellent ductility. |
