| 摘要 |
PURPOSE:To obtain a bubble memory device which is satisfactory in moistureproof, and also inexpensive, by enclosing a bubble memory chip in a case made of ceramic, which case is provided with a standardized simple shape and a hermetic lead wire, and installing it to a desired substrate. CONSTITUTION:A chip 4 is made to die-bond to the bottom face of a case 1 made of ceramic by means of silver pasting. Wire-bonding is made between a bonding pad 5 of a hermetic drawing wiring, and a bonding pad of the chip 4 by use of a metallic wire or an aluminum wire. A cover 6 is made to adhere closely by a reflow solder layer 7 which is provided in advance on an outside circumferential wall end. Subsequently, a notch 8 is sealed by soler 9. The surface of ceramic for making an adhering operation is covered in advance with a metallic layer of gold, etc. The case 1 made of ceramic in which the chip 4 is enclosed hermetically is installed to a plastic substrate according to a kind of the device. In this way, a bubble memory device which is satisfactory in moisturepoof, and also inexpensive is obtained. |
