| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of exfoliation being generated at the interface between a lead part and a sealing resin, when a multiple LGA-type resin-sealed semiconductor device is manufactured, and of the reliability of the semiconductor device being lowered. SOLUTION: In the resin-sealed semiconductor device comprising a multiple lead part, the lead part is composed of a first lead part 14 which comprises first bonding pad parts 14a and first land parts 14b, a second lead part 15 which comprises second bonding pad parts 15a and second land parts 15b and a third lead part 16 which comprises third bonding pad parts 16a and third land parts 16. Each second bonding pad part comprises a constriction part 17, and each bonding pad part comprises an upward protruding step part 18. When stress is applied to each lead part and even if the exfoliation is generated in the interface between the lead part and the sealing resin, exfoliation which is progressing can be stopped by the constriction part 17 and the step part 18. |
