发明名称 SEALING METHOD FOR IC
摘要 PURPOSE:To obtain a film carrier which is thin, small and inexpensive by gang bonding an Ic to a finger-shaped electrode which is formed in a hole of a flexible film and screen printing thermoplastic resin from upper and lower surfaces. CONSTITUTION:A film carrier 2 which has an IC4 gang bonded to a finger- shaped electrode 3a provided in a hole 1a is placed so that an IC4 is contained in a container 10a to a jig 10, a mask 11 is covered from upper surface, a hole 11a is matched to the IC4, resin 12 is screen printed, and the upper surface is sealed. Subsequently, the carrier 2 is overturned and placed on the jig 13 having a container 13a, and the resin 12 is screen printed on the lower surface of the carrier 2 with a mask 14 having a hole 14a. According to this structure, the front and back surfaces of the IC4 and lead wirings 3a are completely sealed in the minimum space, and the film carrier can be mounted in a reduced thickness and size inexpensively.
申请公布号 JPS58204547(A) 申请公布日期 1983.11.29
申请号 JP19820088548 申请日期 1982.05.25
申请人 CITIZEN TOKEI KK 发明人 YOSHIKAWA KENICHI;ICHIKAWA SHINGO
分类号 H01L23/28;H01L21/56;H01L21/60 主分类号 H01L23/28
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