| 摘要 |
<p>PURPOSE:To improve a smoke inhibiting effect by using an epoxy-resin curing agent and an epoxy resin composition containing triphenyl stibine at a specific proportion and coating and molding a semiconductor element. CONSTITUTION:A composition group containing epoxy resin A, a curing agent B and triphenyl stibine C is used, and a semiconductor element is coated and molded by employing an epoxy resin composition, C/(A+B+C) thereof extends over 0.01-0.3, preferably, 0.05-0.15. Known epoxy resin, such as bisphenol type epoxy resin, novolak type epoxy resin, etc. can be used as epoxy resin, and epoxy resin having epoxy equivalent of approximately 170-300 is employed generally. Amines, imidazoles, an acid anhydride, a novolak type phenol resin, etc. can be used by, normally 0.5-2 equivalent, preferably 0.7-1.2 equivalent, per one equivalent of epoxy resin as the curing agent. Accordingly, a semiconductor device having an excellent smoke inhibiting effect is obtained.</p> |
