发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the generation of cracks in a passivation film due to stress on a resin seal by using a substance, in which silicon carbide is made to be contained in aluminum, as an electrode wiring. CONSTITUTION:A substance in which silicon carbide is made to be contained in aluminum is employed as an electrode wiring. A wiring such as a metallic wiring 4 and a section such as a bonding pad section 5 connected to the wiring 4 are formed by aluminum containing 0.5wt% SiC. The wiring 4 and the bonding pad section 5 are shaped in such a manner that the fine powder of silicon carbide in approximately 10mum is dispersed uniformly into aluminum, and changed into a sputtering target through a powder sintering method, and a film is formed onto an inter-layer insulating film 3 consisting of CVD-SiO2 through a sputtering method by using said target, and patterned. Accordingly, the generation of cracks in a passivation film due to stress on a resin seal is prevented, thus obstructing the deterioration of element characteristics and damp-proofness.
申请公布号 JPS61216445(A) 申请公布日期 1986.09.26
申请号 JP19850057719 申请日期 1985.03.22
申请人 TOSHIBA CORP 发明人 AOKI RIICHIRO;ARAKI TOSHINOBU;YODA TAKASHI
分类号 H01L23/52;H01L21/3205;(IPC1-7):H01L21/88 主分类号 H01L23/52
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