BONDING A DEVICE TO A SUBSTRATE

摘要

A method of bonding a device of the type described, comprising forming the upper surface of said base member and/or the lower surface of said substrate with recesses and/or ribs, applying to either or both surfaces a bonding substance, and positioning said substrate on said base member to form a bond with the base member in which the bonding substance is divided into discrete areas whereby to localise stress regions arising in said substance to adjacent said discrete areas.