CIRCUIT PACK COOLING USING PERFORATIONS

摘要

Disclosed is a means for providing forced air cooling of components (22 and 23) mounted on circuit boards (20 and 21) in a stacked configuration. A plurality of perforations (26-29) is provided in the circuit boards so that air flow in the channel between boards causes air to be sucked through the perforations to eliminate stagnant areas between components and provide local jet impingement cooling.