| 摘要 |
PURPOSE:To accurately insert the leads of irregular shaped parts which are easily deformable and hard to be automatically inserted into a substrate and to solder the leads in a preceding process by providing molds for positioning the leads below the leads. CONSTITUTION:The title taping method consists of an irregular shaped parts taping process 11 in which the leads 15a of irregular shaped parts 15 are taped, irregular shaped parts leads inserting mold process 12 in which molds 17 for positioning the leads 15a to the leads 15a, mold bonding agent applying process 13 in which a bonding agent 18 is applied to the substrate inserting contact surfaces of the molds 17, and cutting and substrate inserting process 14 in which the leads 15a are cut and inserted into a substrate 19. Since the parts 15 are not held, but the molds 17, the leads 15a can be accurately inserted into the holes of the substrate 19 including the inserting depth. In addition, since the parts 15 are fixed to the substrate 19 with the bonding agent 18, the leads can be soldered in a preceding process using a solder bath similarly to other standard mounting parts. |
