METHOD AND APPARATUS OF POSITIONING WAFER IN INFRARED ABSORPTION MEASURING APPARATUS

摘要

PURPOSE:To enable measurement at the same measuring point even when setting is made again by determining the measuring point on a wafer based on the X axis as virtual line along an orientation flat which a part of a circumferential surface of the wafer abuts and a Y axis as virtual line orthogonal thereto. CONSTITUTION:A holder 6 with an inch size of a wafer to be measured is set on a stage 4 and a wafer 5 is set on the holder 6. The wafer 5 is fixed with a abutting surface part 12 on the X axis side of the holder 6, an abutting surface part 11 on the Y axis side thereof and a pressing means 13. A virtual line along the orientation flat 5a of the wafer 5 abutting the abutting surface part 11 is taken as Y axis and the virtual line orthogonal to the Y axis as X axis to determine an axis of coordinate intrinsic to the wafer, which allows automatic movement to an arbitrary position where a measurement is desired to carry out. This enables the coinciding of a measuring point of a target again even when the wafer 5 is removed once and hence, allows remeasurement in a microscopic area of the micron order.