MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To easily manufacture a multilayer printed wiring board for improving the heat radiating effect of a substrate. CONSTITUTION:The heat generated from a chip carrier IC 12 is rediated to a multilayer printed wiring board through a chip carrier case main body. In order to efficiently absorb the heat, heat conducting pads 13 are provided in the surface signal layer 19 of the multilayer printed wiring board below the chip carrier case, and the heat is radiated into the air from heat radiating pads 17 provided in the rear signal layer of a substrate through the pads 13 and is transfered to earth layers 15 through holes 14. Many heat radiating through holes 14 are provided in the wiring board 14 and conducting holes thermally and electrically connected to the earth layers 15 and conductive holes electrically isolated form power supply layers 16 are formed.