| 摘要 |
PROBLEM TO BE SOLVED: To obtain an ultra-thin copper foil with base material reinforced resin with which fine lines can be formed. SOLUTION: This ultra-thin copper foil with B-stage resin is obtained by adhering base material reinforcing resin continuously treated with B-stage to a matte surface of the copper foil having a particle size of copper obtained by an electrolytic process of 1μm or less, substantial thickness of 3 to 9μm and a length of copper foil leginess of matted surface of the foil of 5μm or less, and treating with B-stage. And, a method for manufacturing the ultra-thin copper foil comprises the steps of bringing resin obtained by immersing base material with resin composition and drying it, treating it with B-stage into contact with release film, and then continuously laminating opposite surface with the foil by a heating roll and protecting it with a release film. This foil is used to manufacture a multilayer printed circuit board formed with fine lines with excellent adhesive properties, electric characteristics heat resistance and chemical resistance.
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