发明名称 |
Method for fabricating a stacked chip package |
摘要 |
A method for fabricating a stacked chip package comprises the steps of: (a) attaching a first semiconductor chip to an upper surface of a substrate through a first adhesive layer; (b) partially curing the first adhesive layer such that it gels but does not harden; (c) attaching a second semiconductor chip to the first semiconductor chip through a second adhesive layer; (d) curing the first and second adhesive layer; (e) electrically coupling the first and second semiconductor chips to a structure for making external electrical connection provided on the substrate; and (f) forming a package body over the first semiconductor chip, the second semiconductor chip, and a portion of the upper surface of the substrate. Since the first and second adhesive layers may be cured in one single step, the cycle time may be reduced thereby cutting down the production cost.
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申请公布号 |
US2002094605(A1) |
申请公布日期 |
2002.07.18 |
申请号 |
US20020098516 |
申请日期 |
2002.03.18 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
PAI TSUNG-MING;LEE CHUNG-HAO;CHANG CHIN PAO-HEI;LIN MENG-HUI;WANG SONG-FEI |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L21/98;H01L23/48;H01L23/52;H01L25/065;H01L29/40;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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