| 摘要 |
PURPOSE: A method of electrical interlayer connection of multi-layered printed circuit board is provided to manufacture an interlayer via hole for electrically connecting printed circuits of at least three layers. CONSTITUTION: A method of electrical interlayer connection of multi-layered printed circuit board comprises the steps of: forming a printed circuit board composed of a third, a fourth and a fifth layers; corroding circuits and pads of the second and the fifth layers as well as a copper film in the center of a pad of the second layer in which a via hole will be formed, to electrically connect a first, the second and the third layers; forming the first and a sixth layers by multi-laying an insulation layer and a copper layer on the entire surface in high temperature and pressure; corroding the copper layer of the first and the sixth layers according to a predetermined pattern to make an interlayer via hole; eliminating epoxy by irradiating laser beam into the corroded copper layer to manufacture the interlayer via hole; and applying copper layer, by electrical plating, on the inner wall of the interlayer via hole formed in the first, the second and the third layers for electrical connection.
|
