发明名称 SURFACE MOUNTING STRUCTURE AND SURFACE-MOUNTED ELECTRONIC COMPONENT USED IN THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a surface mounting structure suitable for reducing the height and a surface-mounted electronic component used in the surface mounting structure. SOLUTION: A surface-mounted piezoelectric component 1 is provided with an insulating substrate 2 and a piezoelectric resonator 6 mounted on the mounting surface 2a of the insulating substrate 2. The piezoelectric component 1 is mounted on a printed wiring board 11 with its mounting surface 2a disposed on the side of the printed wiring board 11. A recessed part 12 is formed in the printed wiring board 11, and a part of the piezoelectric resonator 6 is housed in the concave part 12. A conductive adhesive 5 on external connection terminals 3 and 4, which are formed on the mounting surface 2a of the insulating substrate 3 is stuck onto circuit patterns 13 and 14 on the printed wiring board 11, for fixing the piezoelectric part 1 on the printed wiring board 11. At the same time, the external connection electrodes 3 and 4 are electrically connected to the circuit patterns 13 and 14 respectively.
申请公布号 JP2000286526(A) 申请公布日期 2000.10.13
申请号 JP19990090160 申请日期 1999.03.30
申请人 MURATA MFG CO LTD 发明人 YOSHIDA RYUHEI;AMANO TSUNEO
分类号 H05K3/32;H01L41/09;H03H9/10;H05K1/18;(IPC1-7):H05K1/18 主分类号 H05K3/32
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