| 摘要 |
PROBLEM TO BE SOLVED: To obtain a small-sized thin solid-state image pickup device, by bonding a solid-state image pickup element to the surface of a glass substrate whereon a group of electrode terminals and a groove frame are formed, and by sealing with a resin the solid-atate image pickup element. SOLUTION: After forming a groove frame 10a on a glass substrate 10, a group of electrode terminals 11 is formed in the outer periphery of the groove frame 10a. Also, bump electrodes 13 are so formed out of Au bumps on the electrodes formed in the peripheral portion of a solid-state image pickup element 12 that the surface of the element 12 is joined to the surface whereon the electrode terminals 11 and the groove frame 10a are formed. Then, the bump electrodes 13 are bonded to the electrode terminals 11 present on the glass substrate 10 by using a conductive bonding agent, etc. Thereafter, an epoxy- based sealing resin 14 is applied to the outer periphery of the solid-state image pickup element 12 to harden it by its heating. Thereby, such a member as a ceramic package is made unnecessary to make obtainable a small-sized thin solid-state image pickup device.
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