| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in soldering heat resistance, heat resistance and adhesion, in particular capable of bonding at low temperatures of <=250 deg.C. SOLUTION: This adhesive composition essentially comprises 100 pts.wt. of a soluble polyimide of general formula (1) (wherein, R1 is a tetravalent organic group; R2 is a trivalent organic group; R3 is a univalent organic group; R4 is a bivalent organic group; p is an integer of 1-4; m is an integer of >=1; and n is an integer of >=0) and 1-150 pts.wt. of a compound having at least two unsaturated double bonds.
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