发明名称 Photolithography process for producing gates and conductive lines
摘要 A lithography process for producing gates and connections thereof, which can reduce the pitch of gate end connections is provided. The process comprises the steps of forming a photoresist layer on the substrate; exposing the photoresist layer by using a phase shifter mask to form a gates pattern in the photoresist layer in the device region; exposing the photoresist layer by using a trimming mask to form a conductive lines pattern connected to the gates pattern in the photoresist layer in the isolation region; and developing the photoresist layer. The trimming mask can be a half-tone mask or a Cr-less alternating phase shifter
申请公布号 US2002110765(A1) 申请公布日期 2002.08.15
申请号 US20010780784 申请日期 2001.02.09
申请人 UNITED MICROELECTRONICS CORP. 发明人 LAI CHIEN-WEN;WANG CHIEN-MING;YANG CHUEN-HUEI;CHANG ANDERSEN
分类号 G03F1/00;G03F7/20;(IPC1-7):G03F7/20 主分类号 G03F1/00
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