发明名称 |
Photolithography process for producing gates and conductive lines |
摘要 |
A lithography process for producing gates and connections thereof, which can reduce the pitch of gate end connections is provided. The process comprises the steps of forming a photoresist layer on the substrate; exposing the photoresist layer by using a phase shifter mask to form a gates pattern in the photoresist layer in the device region; exposing the photoresist layer by using a trimming mask to form a conductive lines pattern connected to the gates pattern in the photoresist layer in the isolation region; and developing the photoresist layer. The trimming mask can be a half-tone mask or a Cr-less alternating phase shifter
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申请公布号 |
US2002110765(A1) |
申请公布日期 |
2002.08.15 |
申请号 |
US20010780784 |
申请日期 |
2001.02.09 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
LAI CHIEN-WEN;WANG CHIEN-MING;YANG CHUEN-HUEI;CHANG ANDERSEN |
分类号 |
G03F1/00;G03F7/20;(IPC1-7):G03F7/20 |
主分类号 |
G03F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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