发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a circuit material having good resistance to flex and connector resistance in a thin-film circuit. SOLUTION: This conductive paste is characterized in that conductive powder (A), a cellulose derivative (B) as a binder and the other organic resins (C) are contained. It is preferred that the conductive powder (A) contains silver powder alone or silver powder not less than 60% by weight, preferably not less than 70% by weight and more preferably not less than 80% by weight. The cellulose derivative (B) contains, for example, celluloseacetatebutylate(CAB) and celluloseacetate(CA) and the like. Suitable other organic resin added has molecular weight not less than 3000 but its sort is not limited.
申请公布号 JP2002260442(A) 申请公布日期 2002.09.13
申请号 JP20010062260 申请日期 2001.03.06
申请人 TOYOBO CO LTD 发明人 TACHIKA HIROSHI;AOKI TAKAO;KONDO KOJI
分类号 C08K3/00;C08L1/00;C08L27/06;C08L67/00;C08L75/06;H01B1/20;H01B1/22;(IPC1-7):H01B1/20 主分类号 C08K3/00
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