Encapsulation method for ball grid array semiconductor package

摘要

An encapsulation method for a ball grid array (BGA) semiconductor package, includes: adhering one sided adhesive tape to an upper portion of the semiconductor package after performing a wire bonding; carrying out a molding by using a mold having a groove of a certain size inside; and removing the one side adhesive tape after completing the molding, whereby a flash is prevented from occurring during the BGA encapsulation process.