发明名称 Vertical insulated gate transistor and manufacturing method
摘要 A vertical insulated gate transistor is manufactured by providing a trench ( 26 ) extending through a source layer ( 8 ) and a channel layer ( 6 ) towards a drain layer ( 2 ). A spacer etch is used to form gate portions ( 20 ) along the trench side walls, a dielectric material ( 30 ) is filled into the trench between the sidewalls gate portions ( 20 ), and a gate electrical connection layer ( 30 ) is formed at the top of the trench electrically connecting the gate portions ( 20 ) across the trench.
申请公布号 US7262460(B2) 申请公布日期 2007.08.28
申请号 US20050538216 申请日期 2005.06.09
申请人 NXP B.V. 发明人 SCHMITZ JURRIAAN;HUETING RAYMOND J. E.;HIJZEN ERWIN A.;MONTREE ANDREAS H.;IN'T ZANDT MICHAEL A. A.;KOOPS GERRIT E. J.
分类号 H01L29/76;H01L21/336;H01L29/423;H01L29/78;H01L29/94;H01L31/00 主分类号 H01L29/76
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