METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To cost-effectively provide a method for a highly reliable mounting which does not require an expensive equipment but removes a solder oxide film with relatively easy method. SOLUTION: A method for mounting electronic components to mount a bare chip on a mounting substrate 1 with solder bumps comprises the step of mechanically and physically removing an oxide film 5 formed on a surface of the solder bumps 2 using a abrasive type cleaner.