发明名称 PLASMA TREATMENT DEVICE/METHOD
摘要 <P>PROBLEM TO BE SOLVED: To optimize plasma for chemical change and chemical bonding by controlling the condition of plasma. <P>SOLUTION: This plasma treatment device comprises a plasma generation chamber for generating the plasma, a plasma temperature control part for controlling the temperature of the plasma, and a plasma treatment chamber for treating an object to be treated, using the plasma generated at the plasma generation chamber. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009082796(A) 申请公布日期 2009.04.23
申请号 JP20070253796 申请日期 2007.09.28
申请人 TOKYO INSTITUTE OF TECHNOLOGY 发明人 OKINO AKITOSHI;MIYAHARA SHUICHI;GOTO MASARU;NAGATA YOICHI;MEGURO TAICHI;NAKAJIMA HISANORI;KUMAGAI KO
分类号 B01J19/08;C01B13/11;H05H1/24 主分类号 B01J19/08
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