SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being thinned.SOLUTION: A semiconductor device 10 has a wiring board 20, a semiconductor element 30 mounted on the wiring board 20; a heat sink 50 provided on a back face of the semiconductor element 30 via an adhesive 40; and an encapsulation resin 60 filled in a gap between the heat sink 50 and the wiring board 20. The heat sink 50 includes: a body part 51 which is formed to overlap the semiconductor element 30 in plan view and is formed to have a plane shape larger than a plane shape of the semiconductor element 30; and a projection 52 which is integrally formed with the body part 51 and formed to project outward from an end of the body part 51 and provided at a position lower than the body part 51. The encapsulation resin 60 is formed to cover both vertical surfaces of the projection 52. A top face 51A of the body part 51 is exposed from the encapsulation resin 60.SELECTED DRAWING: Figure 1