| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can inhibit detachment of a resin from a rewired wire.SOLUTION: A semiconductor device 1 includes: electrode pads 9 formed on a semiconductor substrate 2; a rewired wire 10 which is electrically connected to the electrode pads 9 and routed in a region outside the electrode pads 9; a second resin layer 20 formed on the rewired wire 10; and external terminals 5 electrically connected to the rewired wire 10 via the second resin layer 20. The second resin layer 20 is formed to enter slits 12 formed in regions for the rewired wire 10 along circumferences of the external terminals 5.SELECTED DRAWING: Figure 4 |
