| 摘要 |
A capacitor is disposed within a semiconductor device assembly atop a plastic layer pad, beneath which passes a pair of leads connected to a semiconductor device. The capacitor is connected to the pair of leads, such as by soldering, spot welding or conductive epoxy through cutouts in the pad. In one embodiment, the cutouts extend into the pad from inner and outer edges thereof. In another embodiment, the cutouts are holes through the pad. A plurality, such as four, capacitors are conveniently disposed atop a corresponding plurality of pads, and are connected to a corresponding plurality of pairs of leads within the semiconductor device assembly. By positioning the capacitor(s) as closely to the semiconductor device as possible, the efficacy of the capacitor(s) is maximized. Method and apparatus are disclosed.
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