| 发明名称 | Electronic device package and manufacturing method thereof | ||
| 摘要 | An electronic device package of the disclosure includes a gas barrier substrate, a base layer, an electronic device and a barrier film. The base layer is disposed on the gas barrier substrate and made of a light curing material. The electronic device is disposed on the base layer. The barrier film is disposed on the gas barrier substrate, in which the barrier film and the gas barrier substrate clad the electronic device and the base layer. The disclosure also provides a manufacturing method of an electronic device package. | ||
| 申请公布号 | US9373803(B2) | 申请公布日期 | 2016.06.21 |
| 申请号 | US201414451452 | 申请日期 | 2014.08.05 |
| 申请人 | Wistron Corporation | 发明人 | Kao Chi-Jen;Chiang Ko-Yu;Wang Yi-Kai;Hu Tarng-Shiang |
| 分类号 | H01L51/10;H01L51/00;H01L51/44;H01L51/52 | 主分类号 | H01L51/10 |
| 代理机构 | Jianq Chyun IP Office | 代理人 | Jianq Chyun IP Office |
| 主权项 | 1. An electronic device package, comprising: a gas barrier substrate; a base layer, disposed on the gas barrier substrate and made of a light curing material; an electronic device, disposed on the base layer; and a barrier film, disposed on the gas barrier substrate, wherein the barrier film and the gas barrier substrate clad the electronic device and sidewall of the base layer. | ||
| 地址 | New Taipei TW | ||