FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

Disclosed are a flexible printed circuit board and a manufacturing method thereof. The flexible printed circuit board according to an aspect of the present invention includes an inner layer substrate part, an outer layer substrate part which is stacked on the inner layer substrate part and has a cavity formed in a part of a hard region, and a stack body which exposes a pad having the cavity and is stacked on a layer on which the pad is formed, in the hard region. The stack body is formed by stacking a coverlay layer and a copper layer. The coverlay layer is located on the inner layer substrate part.