PIEZOELECTRIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention provides a piezoelectric package and a method of manufacturing the same. The piezoelectric package includes a base substrate and a piezoelectric body which is formed on the base substrate and has a piezoelectric element mounted therein. Since an open surface of the piezoelectric body is mounted on the base substrate to maintain the vacuum of the piezoelectric element, a process and equipment for treating a metal lead of sealing the piezoelectric element are not needed. So, the piezoelectric package can be made thin.