发明名称 銅合金板材および電気・電子部品
摘要 There is provided a copper alloy sheet including 1.0 to 3.5 mass% Ni, 0.5 to 2.0 mass% Co, and 0.3 to 1.5 mass% Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni + Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface.
申请公布号 JP5961335(B2) 申请公布日期 2016.08.02
申请号 JP20100123756 申请日期 2010.05.31
申请人 DOWAメタルテック株式会社 发明人 高 維林;菅原 章;宮原 良輔;須田 久
分类号 C22C9/06;C22C9/00;C22C9/01;C22C9/02;C22C9/04;C22C9/05;C22C9/10;C22F1/00;C22F1/08;H01B1/02;H01B5/02;H01B13/00 主分类号 C22C9/06
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