| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal mold capable of surely suppressing generation of resin burr without modifying a substrate, and a manufacturing method of a molding.SOLUTION: In the metal mold for encapsulating a semiconductor therein, a semiconductor element mounted on a lead frame is disposed within a cavity that is formed from an upper mold cavity block and a lower mold cavity block 210. In the state where the lead frame is held between the upper mold cavity block and the lower mold cavity block 210, in the metal mold, an encapsulation resin supplied into a pot of a pot block 220 is injected through a cull and a runner 300 into the cavity by a plunger. In the upper mold cavity block, a projection 111 is formed. The projection 111 presses the lead frame during clamping. Thus, an end face of the lead frame is extruded and a gap, communicating to the runner, between the end face of the lead frame and a wall surface of the pot block 220 opposite to the end face is closed.SELECTED DRAWING: Figure 1 |
