THERMOSETTING CONDUCTIVE ADHESIVE

摘要

[Problem] Conventional conductive adhesives had difficulty with balancing storage stability and low-temperature curability, and with manifesting adhesive strength and conductivity when used on poorly-adhesive metal adherends such as gold and nickel. In contrast, the present invention provides an isotropic conductive adhesive that has low-temperature curability in an atmosphere of 80-130°C. [Solution] A thermosetting conductive adhesive containing components (A)-(E) such that the content of the component (E) is 100-1000 parts by mass relative to 100 parts by mass of the total content of the component (A) and the component (B). Component (A): a urethane-modified oligomer having a (meth)acrylic group. Component (B): a monomer having 1 (meth)acrylic group intramolecularly. Component (C): an organic peroxide having a specific structure. Component (D): a phosphate ester compound. Component (E): conductive particles surface-treated with stearic acid.