| 摘要 |
1,268,850. Magnetic structures. GENERAL ELECTRIC CO. 17 July, 1969 [29 July, 1968], No. 35997/69. Heading HlH. [Also in Division C7] A magnetic film less than 15,000 A thick and having a circumferential magnetic orientation, e.g. for a magnetic memory device, is formed upon a conductive wire substrate by electrodeposition, e.g. of Ni-Fe alloy from a plating bath comprising a solution of 98À7 g/l. FeSO 4 - 7H 2 O, 433 g/l. NiSO 4 .6H 2 O, 25 g/l. H 3 BO 3 , 0À25 g/l. each of Na lauryl sulphate and thiourea, and H 2 SO 4 to bring pH to 2, in a rotating linear magnetic field of strength greater than 15 oersteds at the substrate surface. The magnetic field may be formed by positioning a plurality of coils about the plating bath 18 circumferentially relative to the axis of the substrate 27, e.g. two diametrically opposed pairs of coils 20A, 20B and 20C, 20D each energized by 90-degree phase displaced A.C. sources 32, 36 respectively to rotate the field preferably at a frequency of one revolution per 10Š layer of magnetic film electrodeposited; alternatively three coils may be spaced 120 degrees apart about the axis and each energized by a single phase of a 3-phase source, or permanent magnets may be rotated about the periphery. The film may be annealed below 400‹ C. to increase the coercive force of the film. The substrate may be a Au plated tungsten wire, first electrolytically cleaned in a solution of 17 g/l. Na 2 CO 3 , 13 g/l. Na 3 PO 4 .12H 2 O, 7 g/l. NaOH and 0À4 g/l. Na lauryl sulphate, then Cu plated in bath containing 225 g/l. CuSO 4 .5H 2 O, 0À05 g/l. thiourea, 0À5 g/l. naphthol sulphonic acid and H 2 SO 4 , to bring pH to 0À7, then again Au plated, prior to Ni-Fe alloy plating, using Pt anodes throughout. CoSO 4 may be added to the alloy plating bath. Specification 1,183,288 is referred to. |
