发明名称 REMOVAL OF BINDER FROM MULTILAYER CERAMIC STRUCTURE
摘要 PURPOSE: To attain a product, having properties which hardly change by heating a raw structure including a metallic circuit mechanism up to a temperature, at which the generation of a binder or a carbonaceous material from a structure can be almost stopped in an initial atmosphere and a succeeding atmosphere. CONSTITUTION: A raw module, including a metallic circuit mechanism combined by polybinder and consisting of alumina grains, is heated at a temperature capable of turning a chemical balance relation, so that an atmosphere is neutral or reducing for a metal used and oxidative for carbon at about 2 to 10 K/min speed. In the case of a tungsten circuit mechanism introducing wafer to the atmosphere, the temperature is about 970 K, a required hydrogen/water ratio at this temperature is about 2, and heating is continued at an about 1,270 K temperature range which is capable of starting the sintering of alumina grains. Thereby opened pores of alumina from which carbonaceous materials can be removed by reaction with an oxidative atmosphere start to be closed, heating is continued up to about 1,825 K and held, the structure is cooled at a baking temperature, and a product having a low level of a carbonaceous residue can be attained.
申请公布号 JPH06169174(A) 申请公布日期 1994.06.14
申请号 JP19930219250 申请日期 1993.08.12
申请人 PURAKUSUEA TECHNOL INC 发明人 YAAKU SUTEFUAAN BAN DEN SHIPE
分类号 C04B35/634;C04B35/638;H05K1/09;H05K3/46 主分类号 C04B35/634
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