| 摘要 |
A semiconductor pressure sensor having a plurality of pressure-sensitive diaphragms so as to deliver outputs of at least two kinds of pressures as electric signals. This semiconductor pressure sensor comprises a monocrystalline semiconductor chip (1) formed thereon with at least two pressure-sensitive diaphragms (12a, 12b), a pair of strain gauges (13a and 14a, or 13b and 14b) formed on each pressure-sensitive diaphragms of the monocrystalline semiconductor chip, electrodes (15a and 16a, or 15b and 16b) provided on the monocrystalline semiconductor chip to electrically connect the strain gauges with each other, and a substrate (2) of borosilicate glass having the coefficient of thermal expansion, which is substantially equal to that of the monocrystalline semiconductor chip, said monocrystalline semiconductor chip (1) and said glass substrate (2) being bonded together by means of an anodic bonding process. According to this invention, there may be provided the pressure-sensitive sensor has a reduced output error. |
